Global Semiconductor Packaging Materials market: Trends and Growth (4.79% CAGR) Segments Forecast 2016-2020

About Semiconductor Packaging Materials

Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.

Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.

Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

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Key vendors
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell
• KYOCERA
• Toppan Printing

Other prominent vendors
• Alpha Advanced Materials
• Applied Materials
• ASM Pacific Technology (ASMPT)
• BASF
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Duksan Hi-metal
• Diehl Metall
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shinko
• Shin-Etsu Chemical
• Shanghai Sinyang Semiconductor Materials
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics

Market driver
• Rising demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report

Market challenge
• Fluctuating foreign exchange rates
• For a full, detailed list, view our report

Market trend
• Rapid technological changes
• For a full, detailed list, view our report

Key questions answered in this report
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

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Table of Content

PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Market overview
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Technology landscape
• Semiconductor packaging and assembly
• Wafer-level versus die-level packaging and assembly
• Roadmap of the semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry
PART 06: Semiconductor packaging technology
• Small outline (SO) packages
• Grid array (GA) packages
• Flat no-leads packages
• Quad flat packages (QFP)
• Dual in-line package (DIP)
• Other technologies
PART 07: Market landscape
• Market overview
• Market size and forecast
• PEST analysis
• Five forces analysis
PART 08: Market segmentation by type of material 
• Global semiconductor packaging materials market by type of material 2015-2020
• Global organic substrates market
• Global bonding wires market
• Global leadframes market
• Global encapsulation resins market
• Global ceramic packages market
• Global die attach materials market
• Global solder balls market
• Global other semiconductor packaging materials market
PART 09: Geographical segmentation
• Global semiconductor packaging materials market geographically 2015-2020
• Semiconductor packaging materials market in APAC
• Semiconductor packaging materials market in North America
• Semiconductor packaging materials market in Europe
PART 10: Key leading countries
• Taiwan
• China
• Japan
PART 11: Market drivers
PART 12: Impact of drivers
PART 13: Market challenges
PART 14: Impact of drivers and challenges
PART 15: Market trends
PART 16: Vendor landscape
• Competitive scenario
PART 17: Key vendor analysis
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell International
• Kyocera
• Toppan Printing
• Other prominent vendors
PART 18: Appendix 

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